DIP（Dual-In-line packages） have been an industry standard for a long time. The applications are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers. These packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance. Using TH ( through hole) and assembly, DIP provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs.
Reliability Test Standards
The test criterion is zero defect out of 77 sampling units.
CopyRight 2015 All Right Reserved xf881.
地址：江苏省南通市崇川路288号 电 话：0513-85058888 传 真：0513-85058868